FA930217C0001

IGF::OT::IGF HIGH ENERGY DENSITY ON-CHIP MICRO-ULTRACAPACITORS THROUGH NANOMANUFACTURING AND DESIGNER ELECTROLYTES STTR

Defense Contract Management Agency · United States

This tender closed on Thursday, June 6, 2019. Browse open opportunities

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Time Left to Bid

Closed

ClosedDefence & SecurityFederal

Basic information

Reference number: FA930217C0001
Issuing organization: Defense Contract Management Agency · Find award history →
Government level: Federal
Solicitation type: Defence & Security
Title: IGF::OT::IGF HIGH ENERGY DENSITY ON-CHIP MICRO-ULTRACAPACITORS THROUGH NANOMANUFACTURING AND DESIGNER ELECTROLYTES STTR
Source: USASpending (Federal)
Source ID: usa-FA930217C0001

Details

Location: United States

Description

IGF::OT::IGF HIGH ENERGY DENSITY ON-CHIP MICRO-ULTRACAPACITORS THROUGH NANOMANUFACTURING AND DESIGNER ELECTROLYTES STTR Awarded to: MAINSTREAM ENGINEERING CORP Agency: Department of Defense Sub-agency: Defense Contract Management Agency Award type: DEFINITIVE CONTRACT

Dates

Publication: 2017/03/06 12:00:00 AM UTC
Closing date: 2019/06/06 12:00:00 AM UTC

Estimated value

$1.5M USD

Classification

Normalized category

Defence & Security

Source: USASpending (Federal)

Last updated 2026-09-02, 12:05:51 p.m.

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