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FA865020C1958

FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES

Department of the Air Force · United States

This tender closed on Monday, December 30, 2024. Browse open opportunities
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Time Left to Bid

Closed

ClosedDefence & SecurityFederal

Basic information

Reference number
FA865020C1958
Government level
Federal
Solicitation type
Defence & Security
Title
FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES
Source ID
usa-FA865020C1958

Details

Location
United States

Description

FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES Awarded to: MULTIBEAM CORPORATION Agency: Department of Defense Sub-agency: Department of the Air Force Award type: DEFINITIVE CONTRACT

Dates

Publication
2020/08/20 12:00:00 AM UTC
Closing date
2024/12/30 12:00:00 AM UTC

Estimated value

$37.6M USD

Classification

Normalized category

Defence & Security

Source: USASpending (Federal)

Last updated 2026-09-02, 12:08:27 p.m.

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