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80NSSC26P0287
SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS
National Aeronautics and Space Administration · WA, United States
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Time Left to Bid
Awarded
AwardedOtherFederal
Basic information
- Reference number
- 80NSSC26P0287
- Issuing organization
- National Aeronautics and Space Administration · Find award history →
- Government level
- Federal
- Solicitation type
- Other
- Title
- SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS
- Source
- usaspending
- Source ID
- CONT_AWD_80NSSC26P0287_8000_-NONE-_-NONE-
Details
- Location
- WA, United States
Description
SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS Awarded to: SIENNA TECHNOLOGIES, INC. Sub-agency: National Aeronautics and Space Administration Contract type: PURCHASE ORDER
Dates
- Publication
- 2026/02/27 12:00:00 AM UTC
- Closing date
- 2026/07/03 12:00:00 AM UTC
Estimated value
$136K USD
Classification
Normalized category
Other