80NSSC26P0915

80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS

National Aeronautics and Space Administration · WA, United States

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Awarded

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Basic information

Reference number: 80NSSC26P0915
Issuing organization: National Aeronautics and Space Administration · Find award history →
Government level: Federal
Solicitation type: Other
Title: 80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS
Source: usaspending
Source ID: CONT_AWD_80NSSC26P0915_8000_-NONE-_-NONE-

Details

Location: WA, United States

Description

80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS Awarded to: SIENNA TECHNOLOGIES, INC. Sub-agency: National Aeronautics and Space Administration Contract type: PURCHASE ORDER

Dates

Publication: 2026/11/18 12:00:00 AM UTC
Closing date: 2026/11/18 12:00:00 AM UTC

Estimated value

$60K USD

Classification

Normalized category

Other

Source: usaspending

Last updated 2026-09-02, 1:08:14 a.m.

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