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80GRC023F0119
Fabrication and Thermal Analysis of RFMG 3.1 EDU Circuit Boards
National Aeronautics and Space Administration · United States
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Awarded
AwardedOtherFederal
Basic information
- Reference number
- 80GRC023F0119
- Issuing organization
- National Aeronautics and Space Administration · Find award history →
- Government level
- Federal
- Solicitation type
- Other
- Title
- Fabrication and Thermal Analysis of RFMG 3.1 EDU Circuit Boards
- Source
- USASpending (Federal)
- Source ID
- usa-80GRC023F0119
Details
- Location
- United States
Summary
Procurement for the design and production of two RFMG 3.1 educational circuit boards, involving fabrication and comprehensive thermal analysis using commercial grade electronic components.
Description
THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS. Awarded to: HX5 LLC Agency: National Aeronautics and Space Administration Award type: DELIVERY ORDER
Dates
- Publication
- 2023/10/01 12:00:00 AM UTC
- Closing date
- 2027/03/31 12:00:00 AM UTC
Estimated value
$574K – $150K USD
Classification
Normalized category
Other