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1333ND26CNB030008
OU03-FY26-181-NEW MICRO SPECIMENS OF ELECTROPLATED COPPER AND MICRO-SIZED LEAD-FREE SOLDER FOR MECHANICAL TESTING TO FRACTURE.
National Institute of Standards and Technology · United States
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Time Left to Bid
Awarded
AwardedEducation & TrainingFederal
Basic information
- Reference number
- 1333ND26CNB030008
- Issuing organization
- National Institute of Standards and Technology · Find award history →
- Government level
- Federal
- Solicitation type
- Education & Training
- Title
- OU03-FY26-181-NEW MICRO SPECIMENS OF ELECTROPLATED COPPER AND MICRO-SIZED LEAD-FREE SOLDER FOR MECHANICAL TESTING TO FRACTURE.
- Source
- USASpending (Federal)
- Source ID
- usa-1333ND26CNB030008
Details
- Location
- United States
Description
OU03-FY26-181-NEW MICRO SPECIMENS OF ELECTROPLATED COPPER AND MICRO-SIZED LEAD-FREE SOLDER FOR MECHANICAL TESTING TO FRACTURE. Awarded to: AUBURN UNIVERSITY Agency: Department of Commerce Sub-agency: National Institute of Standards and Technology Award type: DEFINITIVE CONTRACT
Dates
- Publication
- 2026/05/01 12:00:00 AM UTC
- Closing date
- 2029/04/30 12:00:00 AM UTC
Estimated value
$1.0M USD
Classification
Normalized category
Education & Training