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23-58184

Die Bonder Equipment

National Research Council Canada · Morganville, New Jersey, Canada

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Awarded

AwardedScientific

Basic information

Reference number
23-58184
Solicitation type
Scientific
Title
Die Bonder Equipment
Source ID
23-58184-award

Details

Location
Morganville, New Jersey, Canada

Summary

Procurement of a die bonder, which is specialized equipment used in semiconductor and microelectronics research and manufacturing for precisely attaching small electronic components.

Dates

Publication
2024/03/07 12:00:00 AM UTC
Closing date
N/A

Estimated value

$134K CAD

Classification

UNSPSC categories

41100000

Normalized category

Scientific

Source: CanadaBuys

Last updated 2026-03-16, 1:24:50 p.m.

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