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80GRC023F0119
THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS.
National Aeronautics and Space Administration · OH, United States
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Awarded
AwardedOtherFederal
Basic information
- Reference number
- 80GRC023F0119
- Issuing organization
- National Aeronautics and Space Administration · Find award history →
- Government level
- Federal
- Solicitation type
- Other
- Title
- THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS.
- Source
- usaspending
- Source ID
- CONT_AWD_80GRC023F0119_8000_80GRC020D0003_8000
Details
- Location
- OH, United States
Description
THIS TO IS FOR THE FABRICATION AND THERMAL ANALYSIS OF TWO "RFMG 3.1" EDU CIRCUIT BOARDS, WHICH WILL BE COMPRISED OF COMMERCIAL GRADE ELECTRONIC PARTS. Awarded to: HX5 LLC Sub-agency: National Aeronautics and Space Administration Contract type: DELIVERY ORDER
Dates
- Publication
- 2023/10/01 12:00:00 AM UTC
- Closing date
- 2027/03/31 12:00:00 AM UTC
Estimated value
$248K USD
Classification
Normalized category
Other