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FA864925P0426
Multilayer Substrate Architectures for Integrated Power and Signal Packaging
Department of the Air Force · United States
This tender closed on Monday, June 21, 2027. Browse open opportunities
Time Left to Bid
Closed
ClosedDefence & SecurityFederal
Basic information
- Reference number
- FA864925P0426
- Issuing organization
- Department of the Air Force · Find award history →
- Government level
- Federal
- Solicitation type
- Defence & Security
- Title
- Multilayer Substrate Architectures for Integrated Power and Signal Packaging
- Source
- USASpending (Federal)
- Source ID
- usa-FA864925P0426
Details
- Location
- United States
Summary
Specialized substrate design for integrated power and signal packaging, likely for advanced military electronic systems. Focuses on innovative multilayer architectural solutions for defense technology infrastructure.
Description
MULTILAYER SUBSTRATE ARCHITECTURES FOR INTEGRATED POWER AND SIGNAL PACKAGING Awarded to: NITRIDE GLOBAL INC Agency: Department of Defense Sub-agency: Department of the Air Force Award type: PURCHASE ORDER
Dates
- Publication
- 2025/09/18 12:00:00 AM UTC
- Closing date
- 2027/06/21 12:00:00 AM UTC
Estimated value
$1.2M USD
Classification
Normalized category
Defence & Security